Facilities

Electron Beam Evaporator



E-Beam evaporation is a physical vapor deposition (PVD) technique whereby an intense, electron beam is generated from a filament and steered via electric and magnetic fields to strike source material (e.g. pellets of Au) and vaporize it within a vacuum environment. At some point as the source material is heated via this energy transfer its surface atoms will have sufficient energy to leave the surface. At this point they will traverse the vacuum chamber, at thermal energy (less than 1 eV), and can be used to coat a substrate positioned above the evaporating material.


RF Magnetron Sputter



Magnetron Sputtering is a Plasma Vapor Deposition (PVD) process in which a plasma is created and positively charged ions from the plasma are accelerated by an electrical field superimposed on the negatively charged electrode or "target". The positive ions are accelerated by potentials ranging from a few hundred to a few thousand electron volts and strike the negative electrode with sufficient force to dislodge and eject atoms from the target. These atoms will be ejected in a typical line-of-sight cosine distribution from the face of the target and will condense on surfaces that are placed in proximity to the magnetron sputtering cathode.


Mask Aligner



Rapid Thermal Annealing



Furnace